Rxreliance

Sulfuric Acid. Oil of Vitriol. CAS RN 7664-93-9. Formula Weight: 98.08. Density: 1.84kg/L. CMOS grade, 95.0-97.0%. Color (APHA): 10 max. Residue after ignition: 2ppm max. Cl: 0.1ppm max. NO3: 0.2ppm max. PO4: 0.3ppm max. Packaged in a glass bottle. Subject to postal/shipping restrictions. 4.08kg.

Hydrochloric Acid. Muriatic acid. CAS RN 7647-01-0. Formula Weight: 36.46. Density: 1.18kg/L. CMOS grade, 37.0-38.0% (by acid-base titration). Color (APHA): 10 max. Extractable organic substances: 3ppm max. Packaged in a glass bottle. Subject to postal/shipping restrictions. 2.72kg.

o-Phosphoric Acid. Orthophosphoric acid; phosphoric acid. CAS RN 7664-38-2. Formula Weight: 98.00. Density: 1.69kg/L. CMOS grade, 85.0-87.0% (by acidimetry). Packaged in a poly bottle. Subject to postal/shipping restrictions. 6.35kg.

Toluene. Semiconductor Grade, 99% min,UN1294,Liquid,DANGER: FLAMMABLE, causes CNS injury, lung & eye irritation,500ml,4L,FLAMMABLE LIQUID,

Toluene. Semiconductor Grade, 99% min,UN1294,Liquid,DANGER: FLAMMABLE, causes CNS injury, lung & eye irritation,500ml,4L,FLAMMABLE LIQUID,

Toluene. Semiconductor Grade, 99% min,UN1294,Liquid,DANGER: FLAMMABLE, causes CNS injury, lung & eye irritation,500ml,4L,FLAMMABLE LIQUID,

Toluene. Semiconductor Grade, 99% min,UN1294,Liquid,DANGER: FLAMMABLE, causes CNS injury, lung & eye irritation,500ml,4L,FLAMMABLE LIQUID,

2-Propanol. Semiconductor Grade, 99.5% min

2-Propanol. Semiconductor Grade, 99.5% min,UN1219,Liquid,DANGER: FLAMMABLE, causes CNS effects, irritates skin & eyes,4L,1L,FLAMMABLE LIQUID,

2-Propanol. Semiconductor Grade, 99.5% min,UN1219,Liquid,DANGER: FLAMMABLE, causes CNS effects, irritates skin & eyes,4L,1L,FLAMMABLE LIQUID,

2-Propanol. Semiconductor Grade, 99.5% min,UN1219,Liquid,DANGER: FLAMMABLE, causes CNS effects, irritates skin & eyes,4L,1L,FLAMMABLE LIQUID,

2-Propanol. Semiconductor Grade, 99.5% min

n-Butyl acetate. Semiconductor Grade, 99% min,UN1123,Liquid,DANGER: FLAMMABLE, irritates skin and eyes,4L,1L,FLAMMABLE LIQUID,

n-Butyl acetate. Semiconductor Grade, 99% min,UN1123,Liquid,DANGER: FLAMMABLE, irritates skin and eyes,4L,1L,FLAMMABLE LIQUID,

n-Butyl acetate. Semiconductor Grade, 99% min,UN1123,Liquid,DANGER: FLAMMABLE, irritates skin and eyes,4L,1L,FLAMMABLE LIQUID,

Methanol. Semiconductor Grade, 99.9% min,UN1230,Liquid,DANGER: FLAMMABLE, causes blindness, narcosis, irritation,4L,1L,FLAMMABLE LIQUID,NO CAN FOR GROUND

Methanol. Semiconductor Grade, 99.9% min,UN1230,Liquid,DANGER: FLAMMABLE, causes blindness, narcosis, irritation,4L,1L,FLAMMABLE LIQUID,NO CAN FOR GROUND

Methanol. Semiconductor Grade, 99.9% min,UN1230,Liquid,DANGER: FLAMMABLE, causes blindness, narcosis, irritation,4L,1L,FLAMMABLE LIQUID,NO CAN FOR GROUND

Acetone. Semiconductor Grade, 99.5%,UN1090,Liquid,DANGER: FLAMMABLE, causes CNS effects, irritates skin & eyes,4L,1L,FLAMMABLE LIQUID,

Acetone. Semiconductor Grade, 99.5%,UN1090,Liquid,DANGER: FLAMMABLE, causes CNS effects, irritates skin & eyes,4L,1L,FLAMMABLE LIQUID,

Acetone. Semiconductor Grade, 99.5%,UN1090,Liquid,DANGER: FLAMMABLE, causes CNS effects, irritates skin & eyes,4L,1L,FLAMMABLE LIQUID,

Silver two part conductive adhesive. EXP. XX/XX Resin and Hardener.WARNING: Irritates skin and eyes,25g,100g.

Silver two part conductive adhesive. EXP. XX/XX Resin and Hardener.WARNING: Irritates skin and eyes,25g,100g.

Buffered Oxide Etch 50:1-POLY BOTTLE-17. Buffered Oxide Etchants are used to etch thin films of silicon dioxide and shape contact and via openings

Ammonium Fluoride 40% Cleanroom MB-POLY BOTTLE-17. Ammonium Fluoride is used to dilute HF solutions for silicon dioxide film etching

TAG NEMO MM 8KBYTE WITH ADHESIVE - T008520

Potassium Hydroxide 45% Cleanroom LP, Standard, Container: Poly bottle, Formula: KOH, CAS Number: 1310-58-3, used to etch silicon. The crystalline orientation of the silicon greatly affects the etch rate making potassium hydroxide an anisotropic etchant. 12lb

Nitric Acid 69.5% Cleanroom LP, Cotainer: Poly bottle, Formula: HNO3, CAS Number: 7697-37-2, strong oxidizing agent, used to oxidize silicon to silicon dioxide and to dissolve metals to metal nitrates. 7lb

Hydrogen Peroxide 30% Gigabit, Container: Poly Bottle, Formula: H2O2, CAS Number: 7722-84-1, used in SC-1 and SC-2 solutions to remove particles from silicon wafers and to remove surface metallic contamination. 9lb

Hydrogen Peroxide 30% Cleanroom MB, Container: Poly Bottle, Formula: H2O2, CAS Number: 7722-84-1, used in SC-1 and SC-2 solutions to remove particles from silicon wafers and to remove surface metallic contamination. 9lb

Hydrofluoric Acid 49% Cleenroom MB.

Hydrochloric Acid 37% Cleanroom LP, Standard, Container: Poly bottle, Formula: HCl, CAS Number: 7647-01-0, key ingredient to remove surface metallic ions by forming soluble metal chlorides. 10lb

Ammonium Hydroxide 29% Cleanroom MB, Container: Poly Bottle, Formula: NH3, CAS Number: 1336-21-6, Storage: 0 Deg F - 80 Deg F, used in a SC-1 solution to remove organics and particles from the surface of a wafer. 8lb

Albumin-Glycerol Fixative, Azer Scientific, 250 mL, Albumin-Glycerol Fixative

KITGRYADHSV EC 2216PT AB SCGMS - EC2216

Loctite Threadlock Sealant. Size: 50mL. AA grade. Perfect for sealing small objects.

SEALANT LOCTITE GRADE C 50ML - 8431

SEALANT LOCTITE GRADE E 50ML - 8031

SEALANT LOCTITE GRADE H 50ML - 7831

GRAY EPXY ADHESIVE KIT 2OZ CS6 - 3501-2OZ

3M Scotch-Weld Epoxy Adhesive. Gray. 0.5L kit. Produces strong, impact-resistant bonds.

GRY ADHSVKIT 2OZ CS6 SCGMS - EC2216-2OZ

ProWick No-Clean Desoldering Braid. Removes up to four times more solder than the conventional wick, and extracts the solder much faster than wicks based on Type R fluxes. Residue is halide-free and nonconductive. On static-dissipative spools. Color: white. Width: 0.9mm. Length: 3.0m.

ProWick No-Clean Desoldering Braid. Removes up to four times more solder than the conventional wick, and extracts the solder much faster than wicks based on Type R fluxes. Residue is halide-free and nonconductive. On static-dissipative spools. Color: yellow. Width: 1.4mm. Length: 3.0m.

ProWick No-Clean Desoldering Braid. Removes up to four times more solder than the conventional wick, and extracts the solder much faster than wicks based on Type R fluxes. Residue is halide-free and nonconductive. On static-dissipative spools. Color: green. Width: 1.9mm. Length: 3.0m.

ETC BOND 556. Electrically conductive, Silver filled, 1:1 Epoxy paste, Good corrosion resistance and mechanical strength to 340-F

Silver Conductive Adhesive 478SS Thinner.

SILVER COLLOIDAL EXTENDER. Acetone base. Fast drying. Average grain size less than 10um. Comes with a brush attached to the cap. Service temperature is 30 minutes at 200[degree]C.

Adhesive. 3M Scotch-WeldEpoxy Adhesive 2216 is a flexible, two-part epoxy adhesive. 2:3 mix ratio, 90 minute work life and handling strength in approximately 10 hours. This kit contains 2 fl. oz. of part B and 2 fl. oz. of part A. AD 2216 B/A 2 OZ .

Epo-Tek H20E Adhesive 1Oz. It is a two component, 100% solid silver-filled epoxy system, silver-resin paste and liquid hardener, mixing ration is 1:1. Features high thermal conductivity, and is very well suited for extensive high temperature applications (300 G 400degC)